Products
Allegro X Advanced Package Designer
IC package layout tool for single- and multi-die packages and chiplets
Custom Analog and RF IC Design Flow
IC Design, Analysis, and Layout Improved with Faster Infrastructure, Deeper Tool Integration, and Innovative Solutions from Cadence Design Systems
Digital IC Design and Signoff from Cadence
In today’s rapidly evolving landscape, designs are growing in size and complexity. As a result, achieving the desired power, performance, and area (PPA) targets has become increasingly challenging. Furthermore, tight schedules further intensify the engineering task at hand. However, Cadence® has developed an integrated digital IC design full flow that addresses these difficulties by incorporating…
OrCAD University Edition
Cadence provides Universities with OrCAD Professional and PSpice CAD licenses.Licenses are provided at a special price (with a big discount, in sets multiple of 5 workstations) It is possible to obtain licenses for free for 3 years, with an extension, in case of signing an agreement with Cadence on exclusive use (the agreement is signed…
Visual System Simulator
Software tool for design and modeling of wireless communication and radar systems
Microwave Office
Cadence® Microwave Office® circuit design software is used by leading manufacturers to develop high-frequency electronics.
OrCAD Standard – optimal PCB CAD for small companies
OrCAD Standard OrCAD Standard CAD capabilities: PCB editor powered by Cadence Allegro™ PCB Editor Rule editor in tabular form Differential Pairs Unlimited Layers Import from P-CAD®, Altium®, DXF Export to Gerber + NC-Drill, DXF, IDF, IDX, mechanical CAD Support for STEP 3D models Availability of PSpice® circuit simulator (basic configuration) Library of components and SPICE…
Clarity 3D Solver
Ultra-fast electromagnetic modeling of Multilayer PCBs, IC packages, assemblies
Celsius thermal solver
Device Thermal Distribution Analysis – Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD)
Advanced SI. Layout Workbench environment.
Fast analysis of signal integrity for Multilayer PCB and systems as a whole