Power SI
Sigrity PowerSI will help you run simulations such as ground noise due to simultaneous switching of multiple loads, crosstalk, capacitive coupling between signals and much more.
Electromagnetic simulation in Sigrity PowerSI
Sigrity PowerSI will help you run simulations such as ground noise due to simultaneous switching of multiple loads, crosstalk, capacitive coupling between signals. Simultaneous simulation of the entire printed circuit board is also possible. This software module can be used both for pre-layout and post-layout stage modeling.
With PowerSI, you can test the health of your design and determine what needs to be improved without making PCB samples.
Using the Sigrity PowerSI, you can conduct a wide range of studies and tests. Some of them are capacitive coupling of vias and traces, earth “shifting” while simultaneous switching consumers (SSN), detection of areas where power jumps relative to ground by a significant amount. You can also extract transmission line parameters in a given frequency range (extract S-parameters). This will allow you to examine the transmission line or bus in the time period you are interested in.
Key Features
- Develops recommendations for building a power system of Printed Circuit Board and IC package
- Evaluates electromagnetic capacitive coupling between routing elements in order to find the best positional relationship between VIAs, layout, decaps, and components
- Retrieves the S-parameters of transmission lines. The entire surrounding space is taken into account in the X, Y and Z directions. It is possible to extract S-parameters for PCB and IC packages. Further, the obtained data can be used for time domain analysis
- Shows the electromagnetic field and energy emission in the near-field and far-field of the simulation object
- Helps to develop decoupling capacitor placement strategy and validates placement options. Allows simulation at both low and high frequencies. Accurate and correct DC current characterization possible (patent pending)
- Full 3D simulation of IC packages and PCBs possible (Clarity 3D Layout)
- With an extended license, it is possible to reduce the calculation time when using the “distributed capacitive coupling” option
- Full HSPICE support
- Specifically designed to interface with Cadence SiP Layout, Allegro® Package Designer, and Allegro/OrCAD PCB Designer
- Can simulate designs from: Mentor, Zuken, PCAD and Altium. Supports simultaneous simulation of a system of boards and ICs made in various CAD
