The problem of the influence of connectors on signal integrity is extremely important, especially because of increasing data transmission speed in modern high-speed devices. However, it can be difficult to find s-parameter models that can be used to simulate the high-speed interface in time domain. At the same time, mechanical 3D models of connectors are…

DC Current and Thermal Analysis for IC Packages and PCBs

Electromagnetic simulation

Creating SPICE Models

Ultra-fast electromagnetic modeling of Multilayer PCBs, IC packages, assemblies

Device Thermal Distribution Analysis – Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD)

Mainstream signal and power integrity analysis (SI/PI)

Fast analysis of signal integrity for Multilayer PCB and systems as a whole

Power System Optimization

Optimization of PCB power distribution system, ensuring EMC

Power Integrity and Signal Integrity Analysis Solution