Sigrity X Aurora IC Package Analysis

Over the course of the next several minutes, 30 to 40 minutes, we’d like to give you a perspective on how you can address your IC package design scheduling challenges and help to meet those challenges using an advanced analysis approach that features Indesign analysis. We start the presentation off stating maybe the obvious, that the IC packaging world has changed quite a bit over the past several years. We’ve gone from a world where certainly just delivering a signal from a chip to a printed circuit board through some kind of potentially ceramic carrier, maybe using a lead frame type package was really just a necessary evil and the only objective was to avoid negative impact on the chip. You know electrical and thermal problems, but today the package itself is actually differentiating technology. We’ve spoken to many customers who say they really look at the weight they designed their package as as important as it is the way they designed the actual semi semiconductor itself. And that has to do with the fact that we’ve gone to a more advanced packaging substrate that may include using a silicon interposer stacking die, having multiple die within the package.

It really creates a phenomena in itself and how to make all the signalling and packaging power delivery work within the package. But then of course it needs to work within the entire system. So this is what’s contributing to this world of more than more and we like to discuss how you can make that whole process, that whole design process more efficient. And the way that we expect that you can do that is by being part of a complete multi physics analysis of electronic systems flow.

And while we’ll be talking quite a bit today in this area here of IC packaging, certainly want to make sure that you understand that we extend over the chip in the printed circuit board and provide a full level of solution from power, thermal, and to signal integrity.

And we have our Optimality – intelligent system Explorer, which actually allows you to use AI technology, AIML technology to truly optimize the design early on in the design process.

But today we’re going to focus on the SI, the signal integrity and the power integrity approaches and how to use that in the In-Design world. So from an In-Design analysis perspective, this is where most of the webinar will will talk today.

Workflows available in Allegro X Package Designer with Aurora:

• Design Setup
• Impedance
• Coupling
• Crosstalk
• Reflection
• IR Drop
• Topology Extraction
• XtractIM
• Interconnect Model Extraction (IME)