Modelithics 3D Modeling Services

Modelithics is the industry leader in providing accurate passive and active RF & microwave circuit simulation models. They enable designers to go from concept to product faster and easier.

Meeting the evolving needs of design engineers, Modelithics offers full-wave 3D electromagnetic analysis services to create encrypted 3D models based on detailed physical dimensions and material properties. These models are integrated into powerful 3D simulators, including Ansys® HFSS™.

3D Modeling and Simulation Created from Drawings and Specifications

Supported Simulation Types

• Electromagnetic (EM) simulation, with validations from DC through 110GHz, or higher.
• Electro-Thermal (ET) simulations with direct linkage to an EM simulation. Includes bidirectional data exchange (RF loss and temperature).

Measurement Validation

• Comparison to Vendor’s performance data.
• Comparison to Modelithics’ in-house lab measurements of provided samples.

Product Delivery

• Project file that includes the Unencrypted 3D Model and interconnect environment.
  Does not include unauthorized proprietary material, geometric and configuration information.
• Simulation results including S-parameter files, plots, reports and datasheets.

3D Model for EM simulations

• Encrypted Component 3D Model with available proprietary material, geometric and configuration information.
• Inclusion into the Modelithics COMPLETE+3D Library.
• Project file that includes the Encrypted Component 3D Model and interconnect environment.

Analytic Data Reports Provided

• Standard S-parameter Plots, such as return loss, insertion loss and isolation performance
• ESR (Equivalent Series Resistance)
• Effective Capacitance
• Effective Inductance
• Time Domain Reflectometry Impedance
• Crosstalk
• Eye Diagrams
• Single Ended and Differential Performance
• Coupling
• Thermal Gradients and Peak Temperatures

Supported Components for 3D Modeling

• Resistors/Terminations – Ideal for ET simulations
• Inductors/Coils – Optimized for performance and reduced RAM usage
• Capacitors – Full 3D EM Geometry Models and 3D Brick Models (requires fewer internal details)
• Filters – LTCC, Ceramic Microstrip, PCB Microstrip, etc.
• Coaxial Connectors
• High Density Multipin Connectors – Uses Modelithics’ Dynamic Region Selection feature to significantly reduce RAM and simulation time
• Wire Bonds
• Integrated Circuit Packages
• Other PCB Components – Couplers, power dividers, matching networks, resonators, etc.